絞り込み結果
7 件並び順
34:35ENSemiAnalysis on ASML's Hybrid-Bonding Patents, HBM Economics and the Next Tool Ecosystemゲスト Sherry Zhang, Howie · ホスト Jordan NanosJordan Nanos, Sherry Zhang and Howie examine a track-based bonding design that brings the wafer to the die, then explain why adoption depends on precision, cleanliness, economics and a changing supply chain.
1:00:39ENAmazon CEO Andy Jassy on the $220 Billion AI Buildoutゲスト Andy Jassy · ホスト Ben Horowitz, Erik TorenbergEven at roughly $220 billion of 2026 CapEx, Jassy says Amazon is still turning away AI demand. He tells Ben Horowitz and Erik Torenberg why AWS could become a trillion-dollar run-rate business, and why inference cost, custom chips, and smaller teams matter more than squeezing old customers.
1:09:00ENDwarkesh Patel: What will computer chips look like in 2045?ゲスト Chris Auth, Kevin Fischer, Jack Kavalieros, Tyler Osborn, Pushkar Ranade, Gary Dickerson, Peter Wennink, Elon Musk · ホスト Dwarkesh PatelAfter two days inside Intel’s most advanced fab, Dwarkesh Patel walks through gate-all-around, backside power, High-NA EUV, ruthenium, CFET, and hybrid bonding — and asks Intel’s leadership how the industry can possibly meet AI’s 3×-a-year compute demand when the world’s chipmaking tools cannot.
1:27:05EN20VC on AI Regulation, Compute Economics and Enterprise Adoptionゲスト Jason Lemkin, Rory O’Driscoll · ホスト Harry StebbingsHarry Stebbings, Jason Lemkin and Rory O’Driscoll debate reported AI policy proposals, infrastructure spending, software deployment and startup liquidity.
15:48ENInside Jane Street’s Texas AI Data CenterDwarkesh Patel, Yaron Minsky, Daniel Pontecorvo · Dwarkesh PatelDwarkesh Patel tours a 4,032-GPU training facility with Ron Minsky and Dan Pontecorvo, examining liquid cooling, power distribution and operational safeguards.
1:24:44ENForward Future Live: Portable AI Infrastructure, Software and Formal ProofMatthew Berman, Nick Wentz, Tim Davis, Joseph Floyd, Carina Hong · Forward FutureTim Davis, Joseph Floyd and Carina Hong join Matthew Berman and Nick Wentz for a February 2026 discussion.
51:11ENInside Groq’s LPU: Compilers, Chip Networks and Fast InferenceMatthew Berman, Andrew Ling, Igor Arsovski · Forward FutureGroq engineers Andrew Ling and Igor Arsovski explain their hardware and software design in a sponsored 2024 interview.








