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3 diapositives34:35EN
SemiAnalysis· 23 oct. 2026Podcast · 3 voixSemiAnalysis on ASML's Hybrid-Bonding Patents, HBM Economics and the Next Tool EcosystemInvité : Sherry Zhang, Howie · Anime : Jordan NanosJordan Nanos, Sherry Zhang and Howie examine a track-based bonding design that brings the wafer to the die, then explain why adoption depends on precision, cleanliness, economics and a changing supply chain.SemiconductorsInfrastructure et déploiementGeopolitics
1:00:39EN
a16z· 23 oct. 2026Podcast · 3 voixAmazon CEO Andy Jassy on the $220 Billion AI BuildoutInvité : Andy Jassy · Anime : Ben Horowitz, Erik TorenbergEven at roughly $220 billion of 2026 CapEx, Jassy says Amazon is still turning away AI demand. He tells Ben Horowitz and Erik Torenberg why AWS could become a trillion-dollar run-rate business, and why inference cost, custom chips, and smaller teams matter more than squeezing old customers.AI StrategyInfrastructure et déploiementSemiconductors+2
19 diapositives1:09:00EN
Dwarkesh Patel· 22 oct. 2026Podcast · 9 voixDwarkesh Patel: What will computer chips look like in 2045?Invité : Chris Auth, Kevin Fischer, Jack Kavalieros, Tyler Osborn, Pushkar Ranade, Gary Dickerson, Peter Wennink, Elon Musk · Anime : Dwarkesh PatelAfter two days inside Intel’s most advanced fab, Dwarkesh Patel walks through gate-all-around, backside power, High-NA EUV, ruthenium, CFET, and hybrid bonding — and asks Intel’s leadership how the industry can possibly meet AI’s 3×-a-year compute demand when the world’s chipmaking tools cannot.SemiconductorsAI cost & performanceInfrastructure et déploiement+2
1:26:12EN
20VC with Harry Stebbings· 16 juil. 2026Podcast · 3 voix20VC Roundtable on AI Competition, Enterprise Spending and Venture CapitalInvité : Jason Lemkin, Rory O’Driscoll · Anime : Harry StebbingsHarry Stebbings, Jason Lemkin and Rory O’Driscoll discuss a reported Apple lawsuit, AI pricing, memory markets and venture financing.IA en entrepriseAI cost & performanceVenture Capital+2
1:26:17EN
20VC with Harry Stebbings· 10 avr. 2025Podcast · 3 voixTom Hulme and Stan Boland on Talent, Capital and the UK Tech EcosystemInvité : Tom Hulme, Stan Boland · Anime : Harry StebbingsThe investor and entrepreneur debate how the UK can retain talent, finance global companies and build a stronger technology economy.Venture CapitalEntrepreneurshipAI Strategy+2
8 diapositives1:44:29EN
MBMatthew Berman· 5 sept. 2024Discussing TIME’s 2024 AI 100: Leaders, Researchers and OmissionsMatthew Berman, Alex, Melissa · Forward FutureMatthew Berman, Alex and Melissa review TIME’s list, debate its choices and answer viewers’ questions about AI tools and the industry.AI HistoryAI StrategySemiconductors+2