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34:35ENSemiAnalysis on ASML's Hybrid-Bonding Patents, HBM Economics and the Next Tool EcosystemGast: Sherry Zhang, Howie · Moderation: Jordan NanosJordan Nanos, Sherry Zhang and Howie examine a track-based bonding design that brings the wafer to the die, then explain why adoption depends on precision, cleanliness, economics and a changing supply chain.
1:00:39ENAmazon CEO Andy Jassy on the $220 Billion AI BuildoutGast: Andy Jassy · Moderation: Ben Horowitz, Erik TorenbergEven at roughly $220 billion of 2026 CapEx, Jassy says Amazon is still turning away AI demand. He tells Ben Horowitz and Erik Torenberg why AWS could become a trillion-dollar run-rate business, and why inference cost, custom chips, and smaller teams matter more than squeezing old customers.
1:09:00ENDwarkesh Patel: What will computer chips look like in 2045?Gast: Chris Auth, Kevin Fischer, Jack Kavalieros, Tyler Osborn, Pushkar Ranade, Gary Dickerson, Peter Wennink, Elon Musk · Moderation: Dwarkesh PatelAfter two days inside Intel’s most advanced fab, Dwarkesh Patel walks through gate-all-around, backside power, High-NA EUV, ruthenium, CFET, and hybrid bonding — and asks Intel’s leadership how the industry can possibly meet AI’s 3×-a-year compute demand when the world’s chipmaking tools cannot.
1:26:12EN20VC Roundtable on AI Competition, Enterprise Spending and Venture CapitalGast: Jason Lemkin, Rory O’Driscoll · Moderation: Harry StebbingsHarry Stebbings, Jason Lemkin and Rory O’Driscoll discuss a reported Apple lawsuit, AI pricing, memory markets and venture financing.
1:50:42ENThe Future Live: Open Models, Compute Markets and the Future of Tech MediaMatthew Berman, Nick Wentz, Ben Pouladian, Wayne Nelms, Jayden Clark · Forward FutureMatthew Berman and Nick Wentz speak with Ben Pouladian, Wayne Nelms and Jayden Clark about AI infrastructure, pricing and OpenAI’s acquisition of TBPN.
14:07ENInside Cerebras’s Oklahoma City AI Data CenterMatthew Berman, Andrew Feldman, Billy Wooten · Forward FutureMatthew Berman tours the facility with Cerebras CEO Andrew Feldman and Scale Data Centers COO Billy Wooten, exploring wafer-scale chips, liquid cooling and backup power. Their performance and expansion figures are presented as company claims from 2025.
1:26:17ENTom Hulme and Stan Boland on Talent, Capital and the UK Tech EcosystemGast: Tom Hulme, Stan Boland · Moderation: Harry StebbingsThe investor and entrepreneur debate how the UK can retain talent, finance global companies and build a stronger technology economy.
1:44:29ENDiscussing TIME’s 2024 AI 100: Leaders, Researchers and OmissionsMatthew Berman, Alex, Melissa · Forward FutureMatthew Berman, Alex and Melissa review TIME’s list, debate its choices and answer viewers’ questions about AI tools and the industry.
1:13:59ENJensen Huang’s Computex 2024 Vision: NIM, Blackwell and Physical AIMatthew Berman, Jensen Huang · Forward FutureMatthew Berman presents NVIDIA’s keynote on AI infrastructure, digital humans, weather simulation and robot factories, with the demonstrations and vendor claims in context.
12:37ENThe Reported Stargate Supercomputer and AI’s Compute BottleneckMatthew Berman, Sam Altman, Elon Musk · Forward FutureIn April 2024, Matthew Berman examines a reported Microsoft–OpenAI data-center proposal and argues that chips and electricity could shape the AI industry.
27:07ENSam Altman on AI Abundance, Regulation and the Economics of ComputeMatthew Berman, Sam Altman, Chamath Palihapitiya · Forward FutureA 2024 World Governments Summit interview is followed by Matthew Berman’s discussion of chip investment and open-model competition.









