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34:35EN
SemiAnalysis· 23 oct 2026Pódcast · 3 vocesSemiAnalysis on ASML's Hybrid-Bonding Patents, HBM Economics and the Next Tool EcosystemInvitado: Sherry Zhang, Howie · Presenta: Jordan NanosJordan Nanos, Sherry Zhang and Howie examine a track-based bonding design that brings the wafer to the die, then explain why adoption depends on precision, cleanliness, economics and a changing supply chain.
1:00:39EN
a16z· 23 oct 2026Pódcast · 3 vocesAmazon CEO Andy Jassy on the $220 Billion AI BuildoutInvitado: Andy Jassy · Presenta: Ben Horowitz, Erik TorenbergEven at roughly $220 billion of 2026 CapEx, Jassy says Amazon is still turning away AI demand. He tells Ben Horowitz and Erik Torenberg why AWS could become a trillion-dollar run-rate business, and why inference cost, custom chips, and smaller teams matter more than squeezing old customers.
1:09:00EN
Dwarkesh Patel· 22 oct 2026Pódcast · 9 vocesDwarkesh Patel: What will computer chips look like in 2045?Invitado: Chris Auth, Kevin Fischer, Jack Kavalieros, Tyler Osborn, Pushkar Ranade, Gary Dickerson, Peter Wennink, Elon Musk · Presenta: Dwarkesh PatelAfter two days inside Intel’s most advanced fab, Dwarkesh Patel walks through gate-all-around, backside power, High-NA EUV, ruthenium, CFET, and hybrid bonding — and asks Intel’s leadership how the industry can possibly meet AI’s 3×-a-year compute demand when the world’s chipmaking tools cannot.