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34:35EN
SemiAnalysis· 23 oct 2026Pódcast · 3 vocesSemiAnalysis on ASML's Hybrid-Bonding Patents, HBM Economics and the Next Tool EcosystemInvitado: Sherry Zhang, Howie · Presenta: Jordan NanosJordan Nanos, Sherry Zhang and Howie examine a track-based bonding design that brings the wafer to the die, then explain why adoption depends on precision, cleanliness, economics and a changing supply chain.
1:09:00EN
Dwarkesh Patel· 22 oct 2026Pódcast · 9 vocesDwarkesh Patel: What will computer chips look like in 2045?Invitado: Chris Auth, Kevin Fischer, Jack Kavalieros, Tyler Osborn, Pushkar Ranade, Gary Dickerson, Peter Wennink, Elon Musk · Presenta: Dwarkesh PatelAfter two days inside Intel’s most advanced fab, Dwarkesh Patel walks through gate-all-around, backside power, High-NA EUV, ruthenium, CFET, and hybrid bonding — and asks Intel’s leadership how the industry can possibly meet AI’s 3×-a-year compute demand when the world’s chipmaking tools cannot.
1:28:17EN
20VC with Harry Stebbings· 1 may 2025Pódcast · 4 vocesSeries A and B Investing in an AI Market: Risk, Liquidity and TimingInvitado: Rory O’Driscoll, Jason Lemkin, Fabrice Grinda · Presenta: Harry StebbingsHarry Stebbings, Rory O’Driscoll, Jason Lemkin and Fabrice Grinda debate returns, fund strategy and competition in a fast-changing market.
1:26:17EN20VC with Harry Stebbings· 10 abr 2025Pódcast · 3 vocesTom Hulme and Stan Boland on Talent, Capital and the UK Tech EcosystemInvitado: Tom Hulme, Stan Boland · Presenta: Harry StebbingsThe investor and entrepreneur debate how the UK can retain talent, finance global companies and build a stronger technology economy.