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3 slides34:35EN
SemiAnalysis· Oct 23, 2026Podcast · 3 speakersSemiAnalysis on ASML's Hybrid-Bonding Patents, HBM Economics and the Next Tool EcosystemGuest Sherry Zhang, Howie · Host Jordan NanosJordan Nanos, Sherry Zhang and Howie examine a track-based bonding design that brings the wafer to the die, then explain why adoption depends on precision, cleanliness, economics and a changing supply chain.SemiconductorsInfrastructure & deploymentGeopolitics
1:00:39EN
a16z· Oct 23, 2026Podcast · 3 speakersAmazon CEO Andy Jassy on the $220 Billion AI BuildoutGuest Andy Jassy · Host Ben Horowitz, Erik TorenbergEven at roughly $220 billion of 2026 CapEx, Jassy says Amazon is still turning away AI demand. He tells Ben Horowitz and Erik Torenberg why AWS could become a trillion-dollar run-rate business, and why inference cost, custom chips, and smaller teams matter more than squeezing old customers.AI StrategyInfrastructure & deploymentSemiconductors+2
19 slides1:09:00EN
Dwarkesh Patel· Oct 22, 2026Podcast · 9 speakersDwarkesh Patel: What will computer chips look like in 2045?Guest Chris Auth, Kevin Fischer, Jack Kavalieros, Tyler Osborn, Pushkar Ranade, Gary Dickerson, Peter Wennink, Elon Musk · Host Dwarkesh PatelAfter two days inside Intel’s most advanced fab, Dwarkesh Patel walks through gate-all-around, backside power, High-NA EUV, ruthenium, CFET, and hybrid bonding — and asks Intel’s leadership how the industry can possibly meet AI’s 3×-a-year compute demand when the world’s chipmaking tools cannot.SemiconductorsAI cost & performanceInfrastructure & deployment+2
1:26:12EN
20VC with Harry Stebbings· Jul 16, 2026Podcast · 3 speakers20VC Roundtable on AI Competition, Enterprise Spending and Venture CapitalGuest Jason Lemkin, Rory O’Driscoll · Host Harry StebbingsHarry Stebbings, Jason Lemkin and Rory O’Driscoll discuss a reported Apple lawsuit, AI pricing, memory markets and venture financing.Enterprise AIAI cost & performanceVenture Capital+2
1:26:17EN
20VC with Harry Stebbings· Apr 10, 2025Podcast · 3 speakersTom Hulme and Stan Boland on Talent, Capital and the UK Tech EcosystemGuest Tom Hulme, Stan Boland · Host Harry StebbingsThe investor and entrepreneur debate how the UK can retain talent, finance global companies and build a stronger technology economy.Venture CapitalEntrepreneurshipAI Strategy+2
8 slides1:44:29EN
MBMatthew Berman· Sep 5, 2024Discussing TIME’s 2024 AI 100: Leaders, Researchers and OmissionsMatthew Berman, Alex, Melissa · Forward FutureMatthew Berman, Alex and Melissa review TIME’s list, debate its choices and answer viewers’ questions about AI tools and the industry.AI HistoryAI StrategySemiconductors+2