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34:35EN
SemiAnalysis· Oct 23, 2026Podcast · 3 speakersSemiAnalysis on ASML's Hybrid-Bonding Patents, HBM Economics and the Next Tool EcosystemGuest Sherry Zhang, Howie · Host Jordan NanosJordan Nanos, Sherry Zhang and Howie examine a track-based bonding design that brings the wafer to the die, then explain why adoption depends on precision, cleanliness, economics and a changing supply chain.
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Dwarkesh Patel· Oct 22, 2026Podcast · 9 speakersDwarkesh Patel: What will computer chips look like in 2045?Guest Chris Auth, Kevin Fischer, Jack Kavalieros, Tyler Osborn, Pushkar Ranade, Gary Dickerson, Peter Wennink, Elon Musk · Host Dwarkesh PatelAfter two days inside Intel’s most advanced fab, Dwarkesh Patel walks through gate-all-around, backside power, High-NA EUV, ruthenium, CFET, and hybrid bonding — and asks Intel’s leadership how the industry can possibly meet AI’s 3×-a-year compute demand when the world’s chipmaking tools cannot.
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AI Explained· Oct 12, 2026Why AI Labs Keep Racing Despite Their Own Warnings of a Major BreachSam Altman, John Schulman · OpenAIAI Explained examines weakening safeguards, the incentives behind the frontier race, and why research breakthroughs make the next 18 months difficult to forecast.
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20VC with Harry Stebbings· May 1, 2025Podcast · 4 speakersSeries A and B Investing in an AI Market: Risk, Liquidity and TimingGuest Rory O’Driscoll, Jason Lemkin, Fabrice Grinda · Host Harry StebbingsHarry Stebbings, Rory O’Driscoll, Jason Lemkin and Fabrice Grinda debate returns, fund strategy and competition in a fast-changing market.
1:26:17EN20VC with Harry Stebbings· Apr 10, 2025Podcast · 3 speakersTom Hulme and Stan Boland on Talent, Capital and the UK Tech EcosystemGuest Tom Hulme, Stan Boland · Host Harry StebbingsThe investor and entrepreneur debate how the UK can retain talent, finance global companies and build a stronger technology economy.