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34:35EN
SemiAnalysis· Oct 23, 2026Podcast · 3 speakersSemiAnalysis on ASML's Hybrid-Bonding Patents, HBM Economics and the Next Tool EcosystemGuest Sherry Zhang, Howie · Host Jordan NanosJordan Nanos, Sherry Zhang and Howie examine a track-based bonding design that brings the wafer to the die, then explain why adoption depends on precision, cleanliness, economics and a changing supply chain.
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a16z· Oct 23, 2026Podcast · 3 speakersAmazon CEO Andy Jassy on the $220 Billion AI BuildoutGuest Andy Jassy · Host Ben Horowitz, Erik TorenbergEven at roughly $220 billion of 2026 CapEx, Jassy says Amazon is still turning away AI demand. He tells Ben Horowitz and Erik Torenberg why AWS could become a trillion-dollar run-rate business, and why inference cost, custom chips, and smaller teams matter more than squeezing old customers.
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Dwarkesh Patel· Oct 22, 2026Podcast · 9 speakersDwarkesh Patel: What will computer chips look like in 2045?Guest Chris Auth, Kevin Fischer, Jack Kavalieros, Tyler Osborn, Pushkar Ranade, Gary Dickerson, Peter Wennink, Elon Musk · Host Dwarkesh PatelAfter two days inside Intel’s most advanced fab, Dwarkesh Patel walks through gate-all-around, backside power, High-NA EUV, ruthenium, CFET, and hybrid bonding — and asks Intel’s leadership how the industry can possibly meet AI’s 3×-a-year compute demand when the world’s chipmaking tools cannot.