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3 slides34:35EN
SemiAnalysis· Oct 23, 2026Podcast · 3 speakersSemiAnalysis on ASML's Hybrid-Bonding Patents, HBM Economics and the Next Tool EcosystemGuest Sherry Zhang, Howie · Host Jordan NanosJordan Nanos, Sherry Zhang and Howie examine a track-based bonding design that brings the wafer to the die, then explain why adoption depends on precision, cleanliness, economics and a changing supply chain.SemiconductorsInfrastructure & deploymentGeopolitics